Description:This patent application embodies a mesh embedding apparatus, system, and method. Thermoplastics, thermosets, ceramics, and metals can all be embedded. The methods
used are high heat for quick evaporation, or long curing times at a lower temperature.
Abstract:A three-dimensional electronic, biological, chemical, thermal management, and/or electromechanical apparatus can be configured by depositing one or more layers of a three-dimensional structure on a substrate. Such a three-dimensional structure can include one or more internal cavities using an additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be further configured with structural integrated metal objects spanning the internal cavities (possibly filled with air or even evacuated) of the three-dimensional structure for enhanced electromagnetic properties.
Issue Date: 11/05/2019
Application Date: 04/15/2016
Post Date: 05/07/2018
UTEP Docket No: 2015-041
