Enhancements    

3D Volumetric Circuits and Associated Methods

3D Volumetric Circuits and Associated Methods
Inventors: Raymond Rumpf, Cesar Luis Valle, Gilbert Carranza, Ublado Robles
Patent No. 10,974,443

Description:
This invention describes a complete automated CAD-to-print process flow for hybrid direct-write 3D printing.

Abstract:
[0064] For the first time, a fully three-dimensional (3D) electric circuit was modeled in a 3D environment and manufactured via an automated hybrid direct-write 3D printing process. The implications and applications of this significant achievement are enormous because it allows circuits to be designed and manufactured in virtually any form factor. To accomplish this, a custom CAD tool was programmed into an open-source modeling software to layout components and route interconnects. The custom CAD tool imports the netlist and component geometries from a schematic capture program. Components can be placed at any position and be oriented at any angle. Interconnects can meander smoothly throughout the circuit following 3D splines. The interconnects can be placed manually or automatically between components. After laying out the components and routing interconnects, the tool exports Standard Tessellation Language (STL) files of the dielectric and metal portions of the final circuit to be 3D printed. To manufacture the circuit, fused deposition modeling (FDM) of ABS plastic and micro-dispensing (μD) of DuPont CB028 silver paste were used. To demonstrate, a functional 555 timer circuit was designed and built to flash an LED.

Issue Date: 04/13/2021
Application Date: 11/08/2019
Post Date: 07/18/2019

UTEP Docket No: 2019-008