Enhancements    

Method and System for integrating Ultrasonically Embedded Wiring with Additive Manufacturing Technologies for 3D Structural Electronics Fabrication

Method and System for integrating Ultrasonically Embedded Wiring with Additive Manufacturing Technologies for 3D Structural Electronics Fabrication
Inventors: Ryan Wicker, David Espalin, Francisco Medina, Eric MacDonald, Danny Muse
Patent No. 10,518,490

Description:
This patent application embeds filaments such as wires or meshes into 3D printed thermoplastic devices. Then an energy source is applied, generating heat, allowing the formation of 3D structural components, devices, or systems. The filaments can also be connected to other filaments and components.

Abstract:
The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh. A method is provided for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

Issue Date: 12/31/2019
Application Date: 03/14/2013
Post Date: 01/09/2020

UTEP Docket No: 2013-004a