Enhancements    

Patents of David Espalin

Metal Objects Spanning Internal Cavities in Structures Fabricated by Additive Manufacturing
Issue Date: 04 - 13 - 2021
Application Date: 10 - 07 - 2019
Patent No. 10,974,499

Structurally Integrating Metal Objects Into Extrusion-Based Additive Manufactured Thermoplastic Structures
Issue Date: 02 - 09 - 2021
Application Date: 09 - 18 - 2017
Patent No. 10,913,202

Extrusion-based additive manufacturing system for 3d structural electronic, electromagnetic and electromechanical components/devices
Issue Date: 08 - 18 - 2020
Application Date: 01 - 04 - 2012
Patent No. 10,748,867

In-situ diagnostics and control method and system for material extrusion 3d printing
Issue Date: 06 - 23 - 2020
Application Date: 04 - 26 - 2017
Patent No. 10,691,095

Methods for connecting inter-layer conductors and components in 3d structures (Continuation)
Issue Date: 05 - 19 - 2020
Application Date: 06 - 17 - 2016
Patent No. 10,660,214

Method and apparatus for wire handling and embedding on and within 3d printed parts
Issue Date: 03 - 03 - 2020
Application Date: 08 - 23 - 2016
Patent No. 10,582,619

CONNECTING METAL FOILS/WIRES AT DIFFERENT LAYERS IN 3D PRINTED SUBSTRATES WITH WIRE SPANNING
Issue Date: 02 - 25 - 2020
Application Date: 02 - 07 - 2017
Patent No. 10,569,464

Methods and Systems For Embedding Filaments in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices
Issue Date: 12 - 31 - 2019
Application Date: 03 - 14 - 2013
Patent No. 10,518,490

Metal objects spanning internal cavities in structures fabricated by additive manufacturing
Issue Date: 11 - 05 - 2019
Application Date: 04 - 15 - 2016
Patent No. 10,464,306

Connecting metal foils/wires and components in 3d printed substrates with wire bonding
Issue Date: 04 - 16 - 2019
Application Date: 02 - 07 - 2017
Patent No. 10,259,081

Multi-layered 3d printed laser direct structuring for electrical interconnect and antennas
Issue Date: 10 - 03 - 2017
Application Date: 07 - 06 - 2016
Patent No. 15/202,936

Method for Connecting Inter-Layer Conductors and Components in 3D Structures
Issue Date: 08 - 09 - 2016
Application Date: 03 - 14 - 2013
Patent No. 9,414,501