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DISPOSABLE, WIRELESS SENSOR SYSTEMS FOR INTEGRATION WITHIN MOLDS AND CORES
DISPOSABLE, WIRELESS SENSOR SYSTEMS FOR INTEGRATION WITHIN MOLDS AND CORES
PI: Eric MacDonald
Sponsor: AMERICAN FOUNDRY SOCIETY
Mechanical Engineering
Amount awarded: $45,000
This project embeds wireless, disposable sensor systems within 3D molds and cores.
Posting date:
Tue, 08/17/2021
Award start date:
Mon, 08/02/2021
Award end date:
Fri, 07/29/2022