Enhancements    

INVESTIGATION OF RADIATION SHIELDING OF ADDITIVELY MANUFACTURED ELECTRONIC PACKAGING

INVESTIGATION OF RADIATION SHIELDING OF ADDITIVELY MANUFACTURED ELECTRONIC PACKAGING
PI: Robert Roberts
Sponsor: SANDIA NATIONAL LABORATORY
Electrical and Computer Engineering
Amount awarded: $50,000

In close partnership with Sandia National Laboratory, this funding supports research of additive manufactured electronic packages with enhanced radiation shielding properties.

Posting date: Thu, 05/04/2023

Award start date: Thu, 03/09/2023
Award end date: Sat, 09/30/2023