| MULTI-FUNCTIONAL BAAM: BIG AREA ADDITIVE MANUFACTURING WITH MULTI-PURPOSE WIRE EMBEDDING PI: Ryan Wicker Co-PI: Eric MacDonald, David Espalin Sponsor: AIR FORCE RESEARCH LABORATORY THROUGH NATIONAL CENTER FOR DEFENSE MANUFACTURING AND MACHINING W.M. Keck Center for 3-D Innovation Amount awarded: $1,000,000
To surpass conventional plastic processing technologies, UTEP has partnered with Cincinnati Incorporated (CI) to introduce wire embedding capabilities into CI's Big Area Additive Manufacturing (BAAM) machine to offer a new level of 3D printing with multifunctionality. The team also includes Autodesk with supporting members Lockheed Martin Aeronautics and GE Appliances. Specifically, the project 1) integrates UTEP's wire embedding technology into the BAAM-100 machine, 2) develops a software solution for 3D wire pattern fabrication, and 3) creates a graduate certificate program in Additive Manufacturing. Posting date: Mon, 11/14/2016 Award start date: Thu, 09/01/2016 Award end date: Thu, 04/05/2018
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