The University of Texas at El Paso (UTEP) is a partner in the workforce development program for the Texas Institute for Electronics (TIE) Next Generation in Microelectronics Manufacturing Center (NGMM), sponsored by the Defense Advanced Research Projects Agency (DARPA). UTEP will establish a research traineeship that supports 6 master’s students each year through a structured combination of coursework, co-curricular training, and experiential learning. Training will include hands-on research in the Electrical and Computer Engineering (ECE) cleanroom and other campus laboratories, as well as internships through TIE and partner industries. Curriculum updates will strengthen preparation in three-dimensional heterogeneous integration (3DHI), electronic design automation (EDA), microsystems, and related semiconductor and microelectronics topics. Program funding blends DARPA support and Texas State Matching Funds (TSMF) to support workforce development, program operations, sponsor requirements, and targeted upgrades to UTEP facilities.