Enhancements    

Method for Connecting Inter-Layer Conductors and Components in 3D Structures

Method for Connecting Inter-Layer Conductors and Components in 3D Structures
Inventors: Ryan Wicker, David Espalin, Daniel Muse, Eric MacDonald, Francisco Medina
Patent No. 9,414,501

Description:
This patent embeds filaments such as wires or meshes into 3D printed  thermoplastic devices. Then an energy source is applied, generating heat,  allowing the formation of 3D structural  components, devices, or systems. The filaments can also be connected to other filaments and components

Abstract:
The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

Issue Date: 08/09/2016
Application Date: 03/14/2013
Post Date: 02/28/2018

UTEP Docket No: 2013-004B