Inventors: Ryan Wicker, David Espalin, Danny Muse, Eric MacDonald, Francisco Medina
Description:This patent embeds filaments such as wires or meshes into 3D printed thermoplastic devices. Then an energy source is applied, generating heat, allowing the formation of 3D structural components, devices, or systems. The filaments can also be connected to other filaments and components
Abstract:The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.
Issue Date: 08/09/2016
Application Date: 03/14/2013
Post Date: 02/28/2018
UTEP Docket No: 2013-004B
