Enhancements    

Methods and Systems for Rapid Prototyping of High Density Circuits

Methods and Systems for Rapid Prototyping of High Density Circuits
Inventors: Ryan Wicker, Bart Chavez, Don Davis, Phillip Gallegos, Francisco Medina, Jeremy Palmer
Patent No. 7,419,630

Description:
This patent is a 3D printing system to provide increased micro-fabrication and micro-stereolithography. The system achieves reductions in size, mass and manufacturing cycle times of low voltage electrical systems.

Abstract:
A preferred embodiment provides, for example, a system and method of integrating fluid media dispensing technology such as direct-write (DW) technologies with rapid prototyping (RP) technologies such as stereolithography (SL) to provide increased micro-fabrication and micro-stereolithography. A preferred embodiment of the present invention also provides, for example, a system and method for Rapid Prototyping High Density Circuit (RPHDC) manufacturing of solderless connectors and pilot devices with terminal geometries that are compatible with DW mechanisms and reduce contact resistance where the electrical system is encapsulated within structural members and manual electrical connections are eliminated in favor of automated DW traces. A preferred embodiment further provides, for example, a method of rapid prototyping comprising: fabricating a part layer using stereolithography and depositing thermally curable media onto the part layer using a fluid dispensing apparatus.

Issue Date: 09/02/2008
Application Date: 04/22/2005
Post Date: 03/02/2018

UTEP Docket No: 2005-018