Inventors: Ryan Wicker, Danny Muse, Eric MacDonald, Francisco Medina, Rodolfo Salas
Description:This patent involves an electronic die which includes an enclosure, a flexible substrate, a number of LEDs, a sensor, a processor and a battery. The LEDs are disposed on the outer face of each side of the flexible substrate and correspond to the integer assigned to that side. The die is manufactured using 3D printing of dielectric structures with conductive traces serving as electrical interconnects.
Abstract:An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.
Issue Date: 03/06/2018
Application Date: 07/10/2014
Post Date: 03/07/2018
UTEP Docket No: 2012-026
