Patent No. 10,748,867

Description:
"This patent application embodies 3D printed electromechanical devices. These devices are impact resistant and have higher resolution than existing technology. Also, unlike existing technology, chemical cleansing of component and interconnection cavities is not required with this technology."

Abstract:
The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.


UTEP Docket No: 2011-017