Inventors: Ryan Wicker, Francisco Medina, David Espalin, Danny Muse, Eric MacDonald
Description:"This patent application embodies a 3D
device with inter-layer conductors and
components. This technology utilizes
filaments such as wires and
meshes, rather than
conductive traces or antenna
wire. Therefore, the interlayer
has higher current,
conductivity, and durability
capabilities than existing
technology."
Abstract:The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh. A method is provided for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.
Issue Date: 12/31/2019
Application Date: 03/14/2013
Post Date: 05/07/2018
UTEP Docket No: 2013-004A
