Inventors: Ryan Wicker, David Espalin, Francisco Medina, Danny Muse, Eric MacDonald
Description:"This patent application embodies a 3D
device with inter-layer conductors and
components. This technology utilizes
filaments such as wires and
meshes, rather than
conductive traces or antenna
wire. Therefore, the interlayer
has higher current,
conductivity, and durability
capabilities than existing
technology."
Abstract:Systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.
Issue Date: 05/19/2020
Application Date: 06/17/2016
Post Date: 05/07/2018
UTEP Docket No: 2013-004B
