Description:"This patent application embodies a laser
direct structuring method in which it
allows the electrical interconnect
between layers enhanced with
an iterative plating process."
Abstract:A multi-layered 3D printed laser direct structuring method and apparatus for electrical interconnect and antennas. 3D printed components can be configured with structurally integrated metal connections (e.g., bulk highly conductive metal) that traverse multiple layers (some embedded and others external) of a structure fabricated using an additive manufacturing system enhanced with an iterative laser activated plating processes, which includes a novel well side-wall vertical interconnect.
Issue Date: 10/03/2017
Application Date: 07/06/2016
Post Date: 05/08/2018
UTEP Docket No: 2015-052
