Description:This patent application embodies a system
for wire bonding that connects metal
pins in 3D printed substrates. The
system allows isolated metal
structures to be electronically
and mechanically
interconnected for improved
system integration.
Abstract:A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method thereof. One or more layers of a three-dimensional structure are deposited on a substrate. The three-dimensional structure is configured to include one or more internal cavities using, an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure includes one or more structural integrated metal objects spanning the one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties and bonded between two or more other metal objects located at the same layer or different layers of the three-dimensional structure.
Issue Date: 04/16/2019
Application Date: 02/07/2017
Post Date: 05/08/2018
UTEP Docket No: 2016-018
