Patent No. 10,569,464

Description:
This patent application provides an effective connection between conductive traces and surfaces at different layers of the 3D printed dielectric substrate. Traces and surfaces are also connected to metallic pins of components at various layers in the substrate. By spanning a void to serve as a via in the interlayer dielectric, connection of two layers of conductors with conductive inks is facilitated.

Abstract:
A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method of configuring such an apparatus. In an example embodiment, an apparatus can include a substrate and one or more layers of a three-dimensional structure configured on and/or from the substrate. The three-dimensional structure includes one or more internal cavities configured by an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be configured with one or more structural integrated metal objects spanning one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties.


UTEP Docket No: 2016-017