Electronic Dice (Continuation)

Electronic Dice (Continuation)
Inventors: Ryan Wicker, Danny Muse, Francisco Medina, Eric MacDonald, Rodolfo Salas
Patent No. 10,335,673

This patent application is describes methods for manufacturing 3D objects and structures, more specifically 3D structural electronic, electromagnetic and electromechanical components and devices.

An electronic gaming die includes an enclosure, a flexible substrate, a number of light emitting diodes, a sensor, a processor and a battery. The enclosure has N sides where N is equal to or greater than 4. The flexible substrate folds into N sides and fits into an interior of the enclosure, wherein each side has an inner face, an outer face and is assigned an integer from 1 to N. The light emitting diodes are disposed on the outer face of each side of the flexible substrate, wherein the number of light emitting diodes equals the integer assigned to the side of the flexible substrate. The sensor, processor and battery are disposed on one of the inner faces of the flexible substrate.

Issue Date: 07/02/2019
Application Date: 01/19/2018
Post Date: 05/11/2018

UTEP Docket No: 2018-002