Inventors: Ryan Wicker, David Espalin, Danny Muse, Francisco Medina, Eric MacDonald
Patent No. 10-2015-7028963 KR South Korea
Description:This patent application embeds filaments such
as wires or meshes into 3D printed
thermoplastic devices. Then an energy
source is applied, generating heat,
allowing the formation of 3D structural
components, devices, or systems. The
filaments can also be connected to other
filaments and components.
Abstract:The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.
Issue Date: 01/06/2021
Application Date: 03/14/2014
Post Date: 05/15/2018
UTEP Docket No: 2013-004B
