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UTEP EM Lab's Work on 3D/Volumetric Circuits Recognized on Cover of IEEE

Researcher(s) Keywords:

  1. simulation
  2. photonics
  3. photonic crystals
  4. optics
  5. nanophotonics
  6. modeling
  7. metamaterials
  8. frequency selective surfaces
  9. electromagnetics
  10. Computational Electromagnetics
  11. Antennas
  12. Additive manufacturing
  13. 3D printing

Featured Researcher(s):

Rumpf, Raymond
College: Engineering
Department: Electrical and Computer Engineering
UTEP EM Lab's Work on 3D/Volumetric Circuits Recognized on Cover of IEEE
Date: June 24, 2019



For nearly a decade, Raymond C. Rumpf, Ph.D., and his EM Lab team have seen several revolutionary ideas to fruition. Their latest advancement received recent recognition from IEEE, the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity. The IEEE published two papers prepared by Rumpf in the May/June 2019 edition of the publication, IEEE Transactions on Components, Packaging, and Manufacturing Technology.


Full story: [ Link to University Communications ]